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 Flexibility Drives Interest in SiP System-in-package (SiP) technology is emerging as a potential alternative to system-on-chip (SoC) technology in the semiconductor packaging industry. SiP technology attracts considerable interest because of the significantly higher flexibility it offers a design house. This flexibility allows designers to combine multiple semiconductor technologies and reuse intellectual property (IP) from numerous sources. Therefore, designers are able to overcome integration difficulties without affecting any of the individual chip technologies. New analysis from Frost & Sullivan (www.semiconductors.frost.com), Analysis of World Markets and Trends for System-in-Package (SiP) Technology, reveals that these markets earned revenues of US$9.31 billion in 2006 and estimates this to reach $13.40 billion in 2010. “The ability to simplify product system board design and assembly is another strong driver for the growth of SiP technology,” says Frost & Sullivan Senior Research Analyst, Vinoth Praveen. “SiP technology moves the routing complexity from the motherboard to the package substrate, which results in simplified product design and reduces layer count in the motherboard.” The SiP approach offers reduced time-to-market compared to SoC, which makes it particularly suitable for wireless and consumer products. Essentially, SiP represents a feasible solution for products that have a shorter life cycle but still need to combine multiple semiconductor technologies, reuse IP from numerous design houses, and add new features rapidly. Relative to SoC, changes to the system can be made swiftly in the SiP approach as it does not require the entire set to be changed. However, SiP does present certain technical challenges. For instance, it is rare to source the die completely from a single company and dies obtained from different companies sometimes do not function together in a SiP environment. Thus, if a SiP fails during the testing phase of a multi-vendor business model, identifying the faulty die poses a major challenge. Supply chain issues have arisen from the need to manage both packaged and bare die from multiple vendors. Tim Gouldson, |
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Coming in the next issue of
For advertising information e-mail: |
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FEATURE PRODUCT
Pico's
QP series of modules offer a range of regulated output voltages, from 5
vdc to a high voltage output of up to 500 VDC at power ratings of 40-50
watts. Features such as over temperature protection over and under
voltage protection on the input and short circuit protection, are
packaged in a miniature 2.5" x 1.55" x 0.5" encapsulated module. There
is also a 5% plus or minus trim capability, remote option, 3 volt
reference pin, and a special bias for use in a capacitor charging
circuit. |
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On Our Web Site
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| WEB WATCH
Test: Fluke Networks Canada has announced a new Solution Centre on its Web site to help customers solve network Voice over IP (VoIP) problems. The VoIP performance management Solution Centre (www.flukenetworks.ca/voip) leads the user through the basic concepts of VoIP management. Nine technical documents are offered ranging from ‘VoIP Performance Management in the Converged Network’ to ‘VoIP Basics for IT Technicians’. Interface Assemblies: GGI International, a leader in the
custom design and manufacturing of user interface assemblies and
solutions for OEMs, is updating its corporate image. GGI’s new
corporate image includes a new logo, Web site and company brochure
conveying GGI’s breadth of product offering and capabilities. Green: www.workcabin.ca is designed to help green employers and organizations connect with individuals who want to work or volunteer for green businesses, government departments and environmental organizations. Environmentally knowledgeable staff constantly work at matching employers with employees with the training, knowledge, and experience in the field of conservation and sustainability. Power Conversion: Schaefer, Inc. announces the launch of its new Power Conversion Products Web site. The updated site, www.schaeferpower.com, has easy to use menu bars which link to all of its ac/dc power supplies, dc/dc converters, battery chargers, dc/ac pure sine wave inverters and other power conversion products. Schaefer’s product offerings range in power from 50W up to 40kW, along with liquid cooled solutions, featuring a host of mechanical and electrical options. |
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Now ONLINE! Click for Digital Canadian Electronics CARD PACKS
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AutomationDirect
Learn.automationdirect.com is here |
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| Digi-Key
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PolyZen™ Micro-Assembly Protects DC Power Ports
www.circuitprotection.com/polyzen Tyco Electronics/Raychem Circuit Protection |
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At this very moment, buyers are requesting quotes for the manufacturing services you provide. This service is free for buyers. MFG.com
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If
you are interested in participating in this newsletter as a sponsor, or
would like to know more about our products and services, let us
know by reply email, or contact us at 905-727-0077. |
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High Voltage, Hi Power, Regulated DC-DC Converters
